? 2000 microchip technology inc. ds21219e-page 1 mcrf200 features ? contactless programmable after encapsulation read only data transmission 96 or 128 bits of one-time programmable (otp) user memory (also supports 48 and 64-bit protocols) typical operates at 125 khz on chip rectifier and voltage regulator ultra low power operation factory programming and device serialization available encoding options: - nrz direct, differential biphase, manchester biphase modulation options: - direct, fsk, psk (change on data change), psk (change at the beginning of a one) application package type description this device is a radio frequency identification (rfid) tag that provides a bidirectional interface for program- ming and reading the contents of the user array. the device is powered by an external rf transmitter through inductive coupling. when in read mode, the device transmits the contents of its memory array by damping (modulating) the incoming rf signal. the reader is able to detect the damping and decodes the data being transmitted. code length, modulation option, encoding option, and bit rate are set at the factory to fit the needs of particular applications. the user memory array of this device can be programmed contactlessly after encapsulation. this allows the user to keep encapsulated blank tags in stock for on-demand personalization. the tags can then be programmed with data as they are needed. these devices are available in die, wafer, pdip, soic, and cob module form. the encoding, modulation, frequency, and bit rate options are specified by the customer and programmed by microchip technology inc. prior to shipment. array programming and serialization (sqtp) can also be arranged upon request. see tb023 (page 23) for more information. block diagram mcrf200 transmitter/ receiver rf signal data pdip/soic v a v b 1 2 3 4 8 7 6 5 nc nc nc nc nc nc column memory array vcc vss rectifier clock generator coil connections decode row decode modulation control counter data load contactless programmable passive rfid device
mcrf200 ds21219e-page 2 ? 2000 microchip technology inc. 1.0 electrical characteristics 1.1 maximum ratings* storage temperature .................................... - 65 c to +150 c ambient temp. with power applied ................-40 c to +125 c maximum current into coil pads ....................................50 ma *notice: stresses above those listed under ? maximum ratings ? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. exposure to maximum rating conditions for extended peri- ods may affect device reliability. table 1-1: pad function table figure 1-1: die plot table 1-3 rfid pad coordinates (microns) name function v a ,v b coil connection nc no connection, test pad table 1-2: ac and dc characteristics all parameters apply across the specified operating ranges unless otherwise noted. industrial (i): tamb = -40 c to +85 c parameter symbol min. typ. max. units conditions clock frequency f clk 100 ? 150 khz contactless programming time t wc ? 2 ? s 128-bit array data retention 200 ?? years 25 c coil current (dynamic) i cd ? 50 a operating current i dd ? 5av cc = 2v turn-on-voltage (dynamic) for modulation v a v b 10 ?? v pp v cc 2 ?? v dc input capacitance c in ? 2 ? pf between v a and v b v b v a nc nc nc nc passivation openings pad name pad width pad height pad center x pad center y v a 90.0 90.0 427.50 -734.17 v b 90.0 90.0 -408.60 -734.17 note 1: all coordinates are referenced from the center of the die. 2: die size 1.1215 mm x 1.7384 mm.
? 2000 microchip technology inc. ds21219e-page 3 mcrf200 2.0 functional description the rf section generates all the analog functions needed by the transponder. these include rectification of the carrier, on-chip regulation of v pp (programming voltage), and v dd (operating voltage), as well as high voltage clamping to prevent excessive voltage from being applied to the transponder. this section gener- ates a system clock from the interrogator carrier of the same frequency, detects carrier interrupts, and modu- lates the tuned lc antenna for transmission to the interrogator. the chip detects a power-up condition and resets the transponder when sufficient voltage develops. 2.1 rectifier ? ac clamp the ac voltage generated by the transponder tuned lc circuit is full wave rectified. this unregulated volt- age is used as the maximum dc supply voltage for the rest of the chip. the peak voltage on the tuned circuit is clamped by the internal circuitry to a safe level to prevent damage to the ic. this voltage is adjusted during programming to allow sufficient programming voltage to the eeprom. 2.2 coil load modulation the mcrf200 communicates to the reader by am-modulating the coil voltage across the tuned lc circuit. 2.3 v dd regulator the device generates a fixed supply voltage from the unregulated coil voltage. 2.4 v pp regulator this regulates a programming voltage during the pro- gramming mode. the voltage is used for the eeprom array to perform block erasure of the memory as well as single-bit programming during both contact and contactless programming. during reading, this voltage is level-shifted down and kept below the programming voltages to insure that the part is not inadvertently programmed. 2.5 clock generator this circuit generates a clock based on the interrogator frequency. this clock is used to derive all timing in the tag, including the baud rate, modulation rate, and programming rate. 2.6 irq detector this circuitry detects an interrupt in the continuous electromagnetic field of the interrogator. an irq (interrupt request) is defined as the absence of the electromagnetic field for a specific number of clock cycles. this feature is used during contactless programming. 2.7 power-on reset this circuit generates a power-on reset when the tag first enters the interrogator field. the reset releases when sufficient power has developed on the v dd regulator to allow correct operation. the reset trip points are set such that sufficient voltage across v dd has developed, which allows for correct clocking of the logic for reading of the eeprom and configuration data, and correct modulation. 2.8 modulation logic this logic acts upon the serial data being read from the eeprom and performs two operations on the data. the logic first encodes the data according to the configuration bits cb6 and cb7. the data can be sent out direct to the modulation logic or encoded biphase differential, biphase manchester or manchester with idi option. the encoded data is then either passed nrz direct out to modulate the coil, or fsk modulated, or psk modulated with changes on the change of data, or psk with changes on the bit edge of a one. configuration bits cb8 and cb9 determine the modulation option. cb10 is used if the psk option has been selected, and determines if the return carrier rate is f clk /2 or f clk /4.
mcrf200 ds21219e-page 4 ? 2000 microchip technology inc. 3.0 configuration logic control bit register the configuration register determines the operational parameters of the device. the configuration register cannot be programmed contactlessly; it is programmed during wafer probe at the microchip factory. cb11 is always a zero; cb12 is set when successful contact or contactless programming of the data array has been completed. once cb12 is set, device programming and erasing is disabled. figure 3-1 contains a description of the control register bit functions. 3.1 organization the configuration bit register directly controls logic blocks which generate the baud rate, memory size, encoded data, and modulated data. this register also contains bits which lock the data array. 3.2 baud rate timing the chip will access data at a baud rate determined by bits cb2, cb3, cb4, and cb5 of the configuration register. cb2, cb3, and cb4 determine the return data rate (caclk). the default rate of f clk /128 is used for contact and contactless programming. once the array is successfully programmed, the lock bit cb12 is set. when the lock bit is cleared, programming and erasing the device becomes permanently disabled. the config- uration register has no effect on device timing until after the eeprom data array is programmed. if cb2 is set to a one and cb5 is set to a one, the 1.5 bit sync word option is enabled. 3.3 column and row decoder logic and bit counter the column and row decoders address the eeprom array at the clock rate and generate a serial data stream for modulation. this data stream can be up to 128 bits in length. the size of the stream is user programmable with cb1 and can be set to 96 or 128 bits. data lengths of 48 and 64 bits are available by pro- gramming the data twice in the array, end-to-end. the data is then encoded by the modulation logic. the data length during contactless programming is 128 bits. the column and row decoders route the proper voltage to the array for programming and reading. in the programming modes, each individual bit is addressed serially from bit 1 to bit 128.
? 2000 microchip technology inc. ds21219e-page 5 mcrf200 figure 3-1: configuration register cb12 cb11 cb10 cb9 cb8 cb7 cb6 cb5 cb4 cb3 cb2 cb1 array size cb1 = 1 128-bit user array cb1 = 0 96-bit user array timing sync word cb5 = 1 1.5-bit sync word enable cb5 = 0 1.5-bit sync word disable data encoding cb6 = 0; cb7 = 0 nrz_l (direct) cb6 = 0; cb7 = 1 biphase_s (differential) cb6 = 1; cb7 = 0 biphase_l (manchester) cb6 = 1; cb7 = 1 (inverted manchester) modulation options cb8 = 0; cb9 = 0 fsk 0 = fc/8, 1 = fc/10 cb8 = 0; cb9 = 1 direct cb8 = 1; cb9 = 0 psk_1 (phase change on change of data) cb8 = 1; cb9 = 1 psk_2 (phase change at beginning of a one) psk rate option cb10 = 1 clk/4 carrier cb10 = 0 clk/2 carrier (read only) cb11 = 0 array lock bit (read only) cb12 = 0 array not locked cb12 = 1 array is locked cb2 cb3 cb4 rate 0 0 0 mod128 0 0 1 mod100 010mod80 011mod32 100mod64 101mod50 110mod40 111mod16
mcrf200 ds21219e-page 6 ? 2000 microchip technology inc. 4.0 modes of operation the device has two basic modes of operation: native mode and read mode. 4.1 native mode in native mode, a transponder will have an unprogrammed array and will be in the default mode for contactless programming (default baud rate f clk /128, fsk, nrz_direct). 4.2 read mode the second mode is a read mode after the contactless or contact programming has been completed and for the rest of the lifetime of the device. the lock bit cb12 will be set, and when the transponder is powered, it will have the ability to transmit according to the protocol in the configuration register. figure 4-1: typical application circuit pad v b pad v a input capacitance: 2 pf energy data 2.2 nf to reader amplifier/filter from oscillator i ac 740 h 4.05 mh 390 pf f res 1 2 lc ------------------ 1 2 5 khz == 125 khz mcrf200
? 2000 microchip technology inc. ds21219e-page 7 mcrf200 mcrf200 guide product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. sales and support configuration: hex code = three digit hex value to be programmed into the configuration register. three hex characters corre- spond to 12 binary bits. these bits are programmed into the configuration register msb first (cb12, cb11 ? cb1). see the example below. package: wf = sawed wafer on frame (7 mil backgrind) w = wafer (11 mil backgrind) s = dice in waffle pack sn = 150 mil soic p=pdip 1c = 0.45 mm cob module with 1000 pf capacitor 3c = 0.70 mmcob module with 330 pf capacitor temperature i =-40 c to +85 c range: sample part mcrf200-i /w00a number: mcrf200-i/w00a = 125 khz, industrial temperature, wafer package, contactlessly programmable, 96 bit, fsk fc/8 fc/10, direct encoded, fc/50 data return rate tag. the configuration register is: cb12 cb11 cb10 cb9 cb8 cb7 cb6 cb5 cb4 cb3 cb2 cb1 mcrf 200 ? i/wfxxx 00 00 00 000 1 10 data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip corporate literature center u.s. fax: (480) 792-7277 3. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
information contained in this publication regarding device applications and the like is intended through suggestion only and ma y be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. no representation or warrant y is given and no liability is assumed by microchip technology incorporated with respect to the accuracy or use of such information, or infringement of patent s or other intellectual property rights arising from such use or otherwise. use of microchip ? s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec- tual property rights. the microchip logo and name are registered trademarks of microchip technology inc. in the u.s.a. and othe r countries. all rights reserved. all other trademarks mentioned herein are the property of their respective companies. ds21219e-page 8 ? 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